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Simultaneous Visible And Thermal Imaging Of Metals During Machining

机译:加工过程中金属的同时可见光和热成像

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In order to investigate temperatures reached during orthogonal metal cutting, a novel approach for measuring temperatures at the tool-chip interface has been developed based on high-speed thermography. A thermal infrared camera and a visible camera combined through a dichroic beam splitter form the basis for a synchronized visible and infrared imaging system. Pairing the infrared camera with a higher speed visible camera allows for assessment of thermal images with aberrant chip flow or an obstructed view of the tool/chip interface. This feature facilitates the use of the apparatus in machining environments where machining chips or other debris fly about. The measurement setup also includes a force dynamometer, custom timing circuitry, and a high-speed digital oscilloscope to enable timing of frames together with force measurements so that analysis of the infrared images can be compared against the energy levels measured through the cutting forces. The resulting infrared images were converted to radiance temperatures through comparison to a NIST calibrated blackbody. Emissivity was measured by thermally imaging the machining chips heated to known temperatures. Machining experiments were performed at various cutting speeds and at two different infrared wavelengths. Analysis of these experiments gives insight into the relationships between emissivity, temperature, surface condition, infrared wavelength and motion blur. The analysis shows that using the visible, thermal and force data together is a significant improvement over any of these alone. These insights lead to practical guidance for use of infrared imaging systems to image rapidly moving objects.
机译:为了研究在正交金属切削过程中达到的温度,已经开发了一种基于高速热成像技术的测量工具-芯片界面温度的新颖方法。通过二向色分束器组合的红外热像仪和可见光相机构成了同步可见光和红外成像系统的基础。将红外热像仪与更高速度的可见热像仪配对,可以评估热图像,异常的芯片流动或工具/芯片接口的视图受阻。该特征有助于在飞散加工屑或其他碎屑的加工环境中使用该设备。测量设置还包括测力计,自定义定时电路和高速数字示波器,以实现帧定时和测力,从而可以将红外图像的分析与通过切削力测得的能级进行比较。通过与NIST校准的黑体进行比较,将所得的红外图像转换为辐射温度。通过对加热到已知温度的加工芯片进行热成像来测量发射率。在各种切割速度和两个不同的红外波长下进行了机加工实验。通过对这些实验的分析,可以洞悉发射率,温度,表面条件,红外波长和运动模糊之间的关系。分析表明,与单独使用这些数据相比,将可见数据,热数据和力数据一起使用是一项重大改进。这些见解为使用红外成像系统成像快速移动的物体提供了实用指南。

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