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Finite-Element Simulations of Residual Stresses Developed in Ti3AlC2 Diffusion Bonds with a Si Interlayer

机译:带有Si夹层的Ti3AlC2扩散键中产生的残余应力的有限元模拟

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The distributions of the residual stress in Ti3AlC2/Si/Ti3AlC2 diffusion bonded joints were studied using finite element method (FEM) considering the properties of reaction product. The effect of thickness of reaction layer on the residual stress was also investigated. The results indicate that the gradients of the residual stress are great near the joint edge. The maximal residual stress produces at the reaction layer adjacent to the interface of the Ti3Al (Si)C2 solid solution and Ti3AlC2. which can have a great effect on joint strength. With the increase of reaction layer thickness,the magnitudes of the residual stress decrease.
机译:考虑到反应产物的性质,采用有限元方法研究了Ti3AlC2 / Si / Ti3AlC2扩散焊接接头中的残余应力分布。还研究了反应层厚度对残余应力的影响。结果表明,残余应力的梯度在接头边缘附近很大。最大残余应力在与Ti3Al(Si)C2固溶体和Ti3AlC2的界面相邻的反应层处产生。对关节强度有很大的影响。随着反应层厚度的增加,残余应力的大小减小。

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