Institute of Machinery Manufacturing Technology, China Academy of Engineering of Physics (CAEP), Mianyang621900, Sichuan, China gaowei906@qq.com;
Institute of Machinery Manufacturing Technology, China Academy of Engineering of Physics (CAEP), Mianyang621900, Sichuan, China;
Institute of Machinery Manufacturing Technology, China Academy of Engineering of Physics (CAEP), Mianyang621900, Sichuan, China;
Department of Optics Science and Engineering, Fudan University, Shanghai 200438, China;
Institute of Machinery Manufacturing Technology, China Academy of Engineering of Physics (CAEP), Mianyang621900, Sichuan, China wangchaohit@126.com;
Institute of Machinery Manufacturing Technology, China Academy of Engineering of Physics (CAEP), Mianyang621900, Sichuan, China jfang2013@caep.cn;
机译:KDP晶体潮解抛光中材料去除机理的研究
机译:金属材料的抛光特性研究及用于微模具图案超精密抛光的微MR流体喷射抛光系统的开发
机译:间隔距离对流体射流抛光中材料去除特性和表面生成的影响的研究
机译:KDP晶体磨蚀式喷射抛光材料去除机理研究
机译:化学机械抛光(CMP)中材料去除机理的机械方面。
机译:超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
机译:脱落距离对流体喷射抛光材料去除特性和表面产生影响的研究
机译:大块KDp晶体中激光诱导材料的改性。