On Topology Optimization of Laminated Prestressed Plates using a new Interpolation Function

摘要

Laminated plates with different prestress in the layers are topology optimized. The objective is to minimize the deflection due to the pre-stress. The prestress is accounted for by including the force equivalent to the prestressing and adding the initial stress stiffness matrix to the structural stiffness. The calculations of sensitivities are complicated not only by the prestress but also because we are dealing with laminates. The topology optimization problem is solved by using a new interpolation scheme as an alternative to the SIMP (power law) approach. In the examples we are optimizing a practical MEMS (Micro Electro Mechanical Systems) application involving a backplate used in a microphone for hearing aids. In this MEMS application the prestress level is very high.