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Electronics Integration in Conformal Substrates Fabricated with Additive Layered Manufacturing

机译:增材制造制造的共形基板中的电子集成

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A three-dimensional (3D) accelerometer sensor system with microprocessor control was fabricated using a previously developed integrated layered manufacturing system that combines conductive ink dispensing with stereolithography (SL). The electronics are integrated into a conformal substrate that is press-fit into a helmet for the purpose of detecting Traumatic Head Injury (THI) when an excessive acceleration to the head is measured. Applications include monitoring the health of soldiers or athletes. Traditional fabrication of electronics is implemented with a 2 dimensional printed circuit board (PCB), which are not well suited for rugged installations in curved locations such as the interior of a helmet. The advantage of layered manufacturing for the integration of electronics is the ability to fabricate in a conformal substrate - conforming to the curved, complex, and often flexible shapes dictated by the human body.
机译:使用以前开发的集成分层制造系统制造了带有微处理器控制的三维(3D)加速度传感器系统,该系统结合了导电墨水分配和立体光刻(SL)。电子设备被集成在一个保形的基板中,该基板被压装到头盔中,以便在测量到头部的过度加速度时检测头部的颅脑外伤(THI)。应用程序包括监视士兵或运动员的健康。电子产品的传统制造是通过二维印刷电路板(PCB)来实现的,该印刷电路板不太适合在弯曲位置(例如头盔内部)中的坚固安装。分层制造对于电子产品集成的优势在于能够在保形基板中制造-符合人体所决定的弯曲,复杂且通常为柔性的形状。

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