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WAFER-SCALE, SOLID FREEFORM FABRICATION OF FULLY-ASSEMBLED METAL MICRO-MECHANISMS FOR MINIMALLY-INVASIVE MEDICAL DEVICES

机译:微侵袭性医疗设备全组装金属微机构的晶片级,固态自由形式制造

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摘要

The EFAB process was first presented at the SFF Symposium in 1998, at a very early stage of its development. Currently, the technology is able to produce complex 3-D devices-including mechanisms built pre-assembled-in production volumes, using a three-step process of selective electrodeposition of one metal, blanket electrodeposition of another metal, and planarization. Layer thickness is as small as 4 μm, minimum feature size is down to 10 μm, and linear tolerances are ~2 μm. Metals are biocompatible materials with mechanical properties similar to stainless steel. The technology enables new instruments for minimally-invasive surgical and interventional procedures.
机译:EFAB过程在其发展的早期就首次在SFF研讨会上于1998年提出。当前,该技术能够使用选择一种金属的电沉积,另一种金属的整体电沉积和平坦化的三步工艺来生产复杂的3D器件,包括预先组装成批量生产的机构。层厚度小至4μm,最小特征尺寸低至10μm,线性公差为〜2μm。金属是具有与不锈钢相似的机械性能的生物相容性材料。该技术为微创手术和介入程序提供了新的仪器。

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