ADVANCED ELECTRONIC PROGNOSTICS FOR INTEGRATED CIRCUITS

摘要

Existing measurands are not adequate for the next generation of advanced electronic prognostics and health monitoring, especially where integrated circuits are involved. In such cases, waiting for fault and out-of-band indications to occur amounts to prognostic failure. A more sophisticated and proactive level of health monitoring is required. As integrated circuits increase in capability and complexity, they incorporate an increasing number and variety of critical system functions. The ever-shrinking device geometries of successive integrated circuit generations tend to accelerate key physics-level circuit degradation and aging mechanisms, while altering sensitivity to radiation. Specific information about the actual state of these critical parameters is required to give usefully specific advanced warnings. The DOD's growing recognition of these inherent and growing problems has prompted initiatives to pioneer advanced electronic prognostics for integrated circuits. The advent of process-aware integrated circuit prognostics opens up new opportunities for on-site autonomic cross-calibration of prognostic health-monitoring sensors. There are further opportunities for post-service electronic autopsies, forensics, and test-to-failure—which are important additional sources of feedback for mission assurance, security review, product design, prognostic design, and improved RUL prediction. Our paper addresses this strategically-important new frontier for the next generation of advanced integrated circuit electronic prognostics and health condition monitoring.