One trend in assembling consumer electronic products is the requirement of the miniaturization of components and high density assembly on PCBs. With the above demands, 0201 packages have become one of the most interesting spots for electronic manufacturers. To investigate the PCB design and assembly processes on 0201 packages, a 0201 test vehicle was designed, which includes important design factors. These factors consist of pad size, pad shape, solder-mask-defined (SMD) pad vs. non-solder-mask-defined (NSMD) pad, and spacing between components. 9 types of pad designs with different pad sizes and shapes for 0201 packages were tested. This paper will present the results from experiments designed to understand printing issues, such as printer settings, stencil design and stencil technology. Through the analysis of the experimental results, pad design for PCB, stencil design and an assembly process window will be discussed, and recommendations will be made for large volume production purposes.
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