MULTI-LAYER 3D SYSTEM-ON-PACKAGE (SOP) ARCHITECTURES FOR HIGHLY INTEGRATED MICROWAVE AND MILLIMETER WAVE RADIO FRONT-END

摘要

This paper summarizes the development of compact and highly integrated microwave and millimeter wave radio front-end System-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. In addition, the use of flip-chip technology for attaching the MMIC to the module can improve the electrical performance to frequencies as high as 75 GHz, increases the integration level and reduces assembly time and cost. These prototypes suggest the feasibility to develop highly miniaturized cost-effective SOP transceiver applicable not only for wireless applications but also for high-speed optoelectronics links.