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In-situ Fabricated Smart Material Active Sensors for Structural Health Monitoring

机译:用于结构健康监测的原位制造的智能材料有源传感器

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Structural health monitoring (SHM) is currently using piezoelectric wafer active sensors (PWAS) permanently attached to the structure with adhesives. This is often a burdensome and time-consuming task, especially for large structures such as aircraft, bridges, etc. In addition, there are critical applications where the rigid piezoceramic wafers cannot conform to curved surfaces. Another important issue is the long term durability of the bonded interface between the PWAS and the structure, which is often the durability weak link. An in-situ fabricated smart sensor may offer better durability. This paper considers the possibility of fabricating the PWAS directly to the substrate structure in order to alleviate these problems. The paper starts with a review of the state of the art in active composite fabrication. Then, two concepts are considered: the pie/omagnetic composite sensor and the piezoelectric composite PWAS. The piezomagnetic composite was fabricated using Terfenol-D magnetostrictive powder in a fiber reinforced composite beam. The strain-induced magnetic field was detected with a Lakeshore gaussmeter. The piezoelectric composite sensor was prepared by mixing lead zirconate titanate (PZT) particles in an epoxy resin. The mixture was applied onto the structural surface using a mask. After curing, the piezo composite was sanded down to the desired thickness and poled under a high electric field. The resulting in-situ composite PWAS was utilized as a sensor for dynamic vibration and impact. Characterization of the in-situ composite PWAS on aluminum structure have been recorded and compared with ceramic PWAS be fore and after poling. To evaluate the performance of the in-situ composite PWAS, both vibration and impact tests were conducted. Both experiments indicated that in-situ fabrication of active materials composites poses itself as a good candidate for reliable low-cost option for SHM smart sensor fabrication.
机译:结构健康监测(SHM)当前使用的是压电晶片有源传感器(PWAS),该传感器通过粘合剂永久地附着在结构上。这通常是一项繁重且费时的任务,尤其是对于大型结构,例如飞机,桥梁等。此外,在一些关键应用中,刚性压电陶瓷晶片无法适应曲面。另一个重要问题是PWAS与结构之间的键合界面的长期耐用性,这通常是耐用性薄弱环节。原位制造的智能传感器可以提供更好的耐用性。本文考虑了将PWAS直接制造到基板结构上以减轻这些问题的可能性。本文首先回顾了有源复合材料制造的最新技术。然后,考虑两个概念:压电复合材料传感器和压电复合材料PWAS。压电复合材料是使用Terfenol-D磁致伸缩粉末在纤维增强复合材料梁中制成的。用湖岸高斯计检测应变感应磁场。通过将锆酸钛酸铅(PZT)颗粒混合在环氧树脂中来制备压电复合传感器。使用掩模将混合物施加到结构表面上。固化后,将压电复合材料打磨至所需厚度,并在高电场下极化。所得的原位复合材料PWAS被用作动态振动和冲击的传感器。记录了铝结构上原位复合PWAS的表征,并在极化前后将其与陶瓷PWAS进行了比较。为了评估原位复合PWAS的性能,进行了振动和冲击测试。两项实验均表明,活性材料复合材料的原位制造本身可作为SHM智能传感器制造的可靠低成本选择的良好选择。

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