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ELECTRODEPOSITON OF SACRIFICIAL COPPER-MANGANESE ALLOY COATINGS AND THEIR PROPERTIES

机译:牺牲铜锰合金涂层的电沉积及其性能。

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摘要

Two types of Cu-Mn coatings can be obtained by electrodeposition from simple sulfate solution with the only addition of ammonium sulfate. Crystalline type Ⅰ coatings are grown at low current density, while at high current density, amorphous typeⅡ coatings are obtained. Both type of coatings are composed of metallic Cu and Mn. A small amount of codeposited Cu can stabilize the ductile as-deposited centered tetragonal phase. Amorphous coatings do not show any structural transformation at room temperature. The mechanical and tribological properties of Cu-Mn coatings were also tested. Cu-Mn coatings have a lower friction coefficient than reference Cd coatings. Codeposition of Cu decreases the hardness and modulus effectively. Cu-Mn coatings show a barrier or passive behavior under anodic polarization, while the sacrificial characteristics are still preserved. The corrosion appears uniform; the formation of MnO_2 and Cu_2O may account for the good corrosion performance of the coatings.
机译:可以通过仅添加硫酸铵的简单硫酸盐溶液进行电沉积来获得两种类型的Cu-Mn涂层。晶体Ⅰ型涂料在低电流密度下生长,而在高电流密度下,可获得非晶Ⅱ型涂层。两种类型的涂层均由金属铜和锰组成。少量共沉积Cu可以稳定延展性的沉积中心四方相。非晶态涂层在室温下不显示任何结构转变。还测试了铜锰涂层的机械和摩擦学性能。 Cu-Mn涂层的摩擦系数低于参考Cd涂层。 Cu的共沉积有效地降低了硬度和模量。 Cu-Mn涂层在阳极极化下显示出势垒或被动行为,而牺牲特性仍得以保留。腐蚀均匀。 MnO_2和Cu_2O的形成可以说明涂层的良好腐蚀性能。

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