APPLICATION STUDIES ON 3-AMINOPHENYLACETYLENE USED AS REACTIVE DILUENTFOR BISMALEIMIDE AND PHTHALONITRILE RESINS

摘要

Novel bismaleimide and phthalonitrile resins with good processibility were prepared using 3-aminophenylacetylene(3-APA) as reactive diluent. The viscosity of the two resins decreased dramatically with increasing content of 3-APA. The viscosity of the bismaleimide resin including 15% 3-APA was about 100mpa.s at 80℃, and the resin was fit for resin transfer molding (RTM) process at a low injection temperature. During the cure process, 3-APA will co-cure with bismaleimide or phthalonitrile resins without releasing volatiles. The processibility of the two resins was characterized by DSC and rheometer. The results indicated that the two resins cure at lower temperatures than the resins without 3-APA. The thermal properties of the two resins were characterized by TGA and DMA. The 5% weight loss temperature of cured phthalonitrile including 3-APA was above 510℃ not only in nitrogen but also in air, and the Tg of cured phthalonitrile including 3-APA was about 478℃. The results indicated that the cured resins display excellent thermoproperties.