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DESIGN-OPTIMIZATION OF A CURVED LAYERED COMPOSITE PANEL USING EFFICIENT LAMINATE PARAMETERIZATION

机译:基于有效层状参数化的弯曲层状复合板的设计优化

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摘要

Layered composites have proven essential for the successful design of high-performance spacernstructures. The aviation industry are increasingly using more and more layered compositesrnwithin commercial aircraft, replacing traditional aluminum designs, to achieve weight savings.rnWhen optimizing layered composite structures it is desirable to find design solutions that satisfyrnglobal requirements early in the design phases. Particularly because of the number of designrnvariables associated with composite layups once models become more detailed are complex:rnmaterial selection, layer orientation and thickness for each ply for example.rnIn this paper, part of an aircraft door surround model is optimized with respect to the objectivesrnand constraints typical for this type of component. Related load-response calculations, failurernand buckling reserve factor analyses are made. The design process is built around optimizationrnfeatures offered by HyperStudy [1] - a solver-neutral design optimization and stochastic studyrnsoftware - along with ESAComp [2] – a software for design and analysis of composites -rnapplying an efficient laminate layup parameterization approach based on sub-laminates tornsupport manufacturing-oriented design.rnDifferent parameterization concepts are evaluated. Both numerical results and the performancernof the optimized structures are reported and compared with an aluminum baseline design.
机译:事实证明,层状复合材料对于成功设计高性能隔层结构至关重要。航空工业越来越多地在商用飞机中使用越来越多的分层复合材料来代替传统的铝制设计,以实现轻量化。在优化分层复合材料结构时,人们希望找到在设计阶段就能够满足全球要求的设计解决方案。特别是由于一旦模型变得更加详细,与复合材料铺层相关的设计变量的数量就变得很复杂:例如,材料选择,每层的层取向和厚度.rn本文针对部分目标优化了飞机门围模型的一部分此类组件的典型约束。进行了相关的载荷响应计算,破坏和屈曲储备因子分析。设计过程围绕HyperStudy [1]提供的优化功能-一种求解器中立的设计优化和随机研究软件-以及ESAComp [2]-一种用于复合材料设计和分析的软件-采用一种基于子层的高效层压板铺设参数化方法-层压板撕裂支持面向制造的设计。rn评估不同的参数化概念。报告了数值结果和优化结构的性能,并与铝基线设计进行了比较。

著录项

  • 来源
    《SAMPE conference》|2016年|1-12|共12页
  • 会议地点 Long Beach CA(US)
  • 作者单位

    Componeering Inc. Itämerenkatu 8 Helsinki 00180, Finland;

    Componeering Inc. Itämerenkatu 8 Helsinki 00180, Finland;

    Altair Engineering 1820 Big Beaver Rd Troy, MI 48083, United States of America;

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  • 原文格式 PDF
  • 正文语种 eng
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