首页> 外文会议>Riso International Symposium on Materials Science; 20040906-10; Roskilde(DK) >A QUANTITATIVE MEASURE OF MEAN SLIP DISTANCE USING A DISPERSION STRENGTHENED HIGH CONDUCTIVITY COPPER
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A QUANTITATIVE MEASURE OF MEAN SLIP DISTANCE USING A DISPERSION STRENGTHENED HIGH CONDUCTIVITY COPPER

机译:色散增强的高电导率铜的平均滑移距离的定量测量

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The calibration of the mean slip distance λ determined from the tensile tests was compared to the deformation cell size dc of [001] copper crystal and that calculable from a particle-dispersed copper alloy as a function of the flow stress. For deformation at 78 K, λ ≈ d_C/3 and the calculated λ for the two-phase alloy was about 3 times higher than the measured one. The strain rate sensitivity measurement showed that the particles are thermally shearable such that, above 195 K, a constant λ region to indicate the limiting effect of the dispersion disappeared.
机译:将由拉伸试验确定的平均滑移距离λ的标定值与[001]铜晶体的变形晶胞尺寸dc和可以根据颗粒分散的铜合金计算出的流动应力函数进行比较。对于在78 K时的变形,两相合金的λ≈d_C / 3和计算出的λ约为被测合金的3倍。应变速率敏感性测量表明,该颗粒是可热剪切的,从而在195 K以上时,一个恒定的λ区域消失,表明分散的限制作用消失了。

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