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Application of Ultrasonic Testing by Image Technoques to Electronic Parts and Weldment Structures

机译:图像技术超声波检测在电子零件和焊接结构中的应用

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摘要

Ultrasonic testing (UT) by image techniques was developed, by which the flaws can be displayed in B or/and C-scope in two dimension and 3D-scope in three dimension. By utilizing the image techniques, the size, shape, location and distribution of the flaws can tbe identified as images with high accuracy. In this paper, outlines of newly developed image systems are described and applications to electronic parts and so on are shown as well.
机译:开发了通过图像技术进行的超声波测试(UT),通过该测试可以在二维B或/和C显微镜和三维3D显微镜中显示缺陷。通过利用图像技术,可以将缺陷的大小,形状,位置和分布识别为具有高精度的图像。在本文中,描述了新开发的图像系统的概述,并展示了在电子零件等方面的应用。

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