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MDSC of microelectronics materials

机译:微电子材料的MDSC

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摘要

MDSC has been used to study the thermal properties of several classes of materials important in microelectronics. Microporous materials with low dielectric constant may be formed by copolymerizatin of a thermally decomposing, mutually insoluble polymer with the dielectric polymer. Such material show the separate T_g's characteristic of phase separated materials. The low temperature region often has a curving Cp vs. temperature curve that causes difficulty in defining the T_g range and temperature. Measurement of the temperature dependence of the Cp constant over the entire temperature range often improves the shape of the curves, leading to simpler interpretation.
机译:MDSC已用于研究微电子中重要的几类材料的热性能。具有低介电常数的微孔材料可以通过热分解的,互不溶的聚合物与介电聚合物的共聚形成。这种材料表现出相分离材料的单独的T_g特性。低温区域通常具有弯曲的Cp对温度曲线,这导致难以定义T_g范围和温度。在整个温度范围内对Cp常数的温度依赖性进行测量通常会改善曲线的形状,从而简化解释。

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