首页> 外文会议>Proceedings of International Kunming Symposium on Microscopy July 2-5, 2000 Kunming, Yunnan Province, China >Electron microscopy study of cold-deformed high-strength-high-conductivity Cu-Ag Wires
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Electron microscopy study of cold-deformed high-strength-high-conductivity Cu-Ag Wires

机译:冷变形高强度高导电Cu-Ag线的电子显微镜研究

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Co-deformation of in-situ Cu-Ag composite produces high-strength-high-conductivity materials. The composites have various applications such as winding high field magnets. The Ag is chosen because it has different lattice parameter from Cu and has almost no solubility in Cu at room temperature so that additions of Ag introduce limited decreasing of the conductivity. Co-deformation provides the composites with a strengh level as high as 1000MPa. This strength level is significantly higher than that predicted by a law-of-mixture and it is about 1/25 of the theoretical strength of Cu (25000MPa). Moreover, the stress-strain curves indicate internal stresses developed in the materials. This paper reports an electron microscopy investigation of the strengthening mechanisms and internal stresses in Cu-25wtpercentAg composites.
机译:原位Cu-Ag复合材料的共形变产生高强度高导电性的材料。该复合材料具有各种应用,例如缠绕高磁场磁体。选择Ag是因为它具有与Cu不同的晶格参数,并且在室温下几乎没有在Cu中的溶解度,因此添加Ag导致电导率的有限降低。共变形为复合材料提供了高达1000MPa的强度水平。该强度水平明显高于通过混合定律预测的强度水平,约为铜理论强度(25000MPa)的1/25。而且,应力-应变曲线表明材料中产生的内部应力。本文报道了电子显微镜研究Cu-25wt%Ag复合材料的强化机理和内应力。

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