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Microcrystalline Silicon, a Right Material for Reliable Electronic Devices Fabricated at T<180°C

机译:微晶硅,在T <180°C下制造可靠电子设备的合适材料

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Microcrystalline silicon deposited at low temperature is shown to be a right material for the implementation of a low temperature technology leading to reliable and efficient CMOS electronic devices on any low temperature substrate such as transparent plastics. The technology is fully compatible with the present amorphous silicon technology tools. Efficient N-type and P-type doping is reached thanks to the excellent crystallinity of the silicon material deposited at 165°C. N-type and P-type TFTs are fabricated with demonstrated reliability and stability. Their threshold voltage can be externally adjusted. The association of these TFTs led to CMOS inverters with excellent pairing and ring oscillators.
机译:在低温下沉积的微晶硅被证明是实施低温技术的正确材料,该技术可在任何低温基板(例如透明塑料)上实现可靠且高效的CMOS电子设备。该技术与当前的非晶硅技术工具完全兼容。由于在165°C沉积的硅材料具有出色的结晶度,因此可以实现有效的N型和P型掺杂。 N型和P型TFT的制造具有可靠性和稳定性。它们的阈值电压可以从外部调节。这些TFT的组合导致CMOS反相器具有出色的配对和环形振荡器。

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