首页> 外文会议>Proceedings of academy of innovation and entrepreneurship 2009 >HOW TO SPEED UP COMMERCIALIZATION AND MARKET ACCEPTANCE FOR DEVELOPING EMERGING TECHNOLOGY: AN OPEN-INNOVATION PERSPECTIVE
【24h】

HOW TO SPEED UP COMMERCIALIZATION AND MARKET ACCEPTANCE FOR DEVELOPING EMERGING TECHNOLOGY: AN OPEN-INNOVATION PERSPECTIVE

机译:如何加快商业化和市场接受度以发展新兴技术:开放创新的视角

获取原文
获取原文并翻译 | 示例

摘要

It is considered that emerging technology can create windows of new opportunities for late-comer firms to catching up. However, plentiful facts tell us firms face unbelievable difficulties when developing emerging technology mostly because of market uncertainty not technology itself. Accordingly, how to speed up commercialization and market acceptance to achieve continual predominance of catching-up becomes a big challenge for many late-comer firms. This paper concludes three uncertainties, including policy, market and technology, to do an empirical study on TD-SCDMA mobile-phone chip manufacturers and public organizations in TD-SCDMA industry, such as Leadcore, Spreadtrum, Mediatek, T3G, CYIT and Commit, together with TD Forum and TDIA (TD Industry Alliance). Based on case studies, this paper constructs a new conceptual framework to analysis the later-comer's inferior position on market catching-up, with an open-innovation paradigm. It is found that searching for complementary collaborator, adopting open strategy for intellectual property and establishing alliance platform for industry, are extremely critical to speed up commercialization and market acceptance in the early development stage of emerging technology industry.
机译:人们认为,新兴技术可以为后来的公司追赶提供新的机会。但是,大量事实告诉我们,在开发新兴技术时,公司面临着难以置信的困难,这主要是因为市场不确定性而非技术本身。因此,如何加快商业化和市场接受度以实现持续的追赶成为许多后来者的一大挑战。本文总结了三个不确定因素,包括政策,市场和技术,以对TD-SCDMA手机芯片制造商和TD-SCDMA行业的公共组织(如Leadcore,展讯,联发科,T3G,CYIT和Commit)进行实证研究,以及TD论坛和TDIA(TD工业联盟)。本文基于案例研究,构建了一个新的概念框架,以开放式创新范式分析后发者在市场追赶中的劣势。研究发现,在新兴技术产业的早期发展阶段,寻找互补的合作伙伴,采取开放性的知识产权战略并建立行业联盟平台对于加快商业化和市场接受度至关重要。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号