Research on Thermal Shock Resistance of Nitrides Bonded SiC Product

摘要

The influence of bulk density homogeneity, phase composition and microstructure on thermal shock resistance of nitrides bonded SiC were investigated.The results show that the worsened homogeneity,either under quick-cooling or quick-heating condition,can lead to the extension of cracks or change its spread direction, thereby reducing the reliability of products.The size and morphology of the bonding phase of nitride bonded SiC, which might be different due to unstable sintering atmosphere, may influenced the thermal shock resistance of products.The products with larger length to diameter ratio in bonding phase present better thermal shock resistance.