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Pip and Crater Erosion in DC Applications,New Research and Review

机译:直流应用中的点状和坑状侵蚀,新研究与评论

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摘要

A review of previous work plus new research done on pip and crater erosion has been described in this paper.This includes a discussion of factors that both promote or decrease the probability of forming pip and crater erosion during contact switching.New data is shown from tests done on comparing silver tin indium oxide and hard silver, 99.85% Ag 0.15% Ni contacts for pip and crater erosion.The silver tin indium oxide shows lower erosion and less pip and crater transfer on higher DC voltage testing than lower voltages.The hard silver material shows a high erosion rate and a more mound and valley shaped pip and crater formation than the sharp pips that form with silver tin indium oxide.
机译:本文描述了对先前工作的回顾以及对点和坑腐蚀的新研究,包括讨论了在接触切换过程中促进或减少形成点和坑腐蚀的可能性的因素,并从测试中获得了新数据。通过比较银锡铟氧化物和硬银,99.85%Ag 0.15%Ni触点对点蚀和缩孔的腐蚀。与较低电压相比,在较高的直流电压测试中,银锡铟氧化物显示出更低的腐蚀以及更少的点蚀和缩孔转移。与用银锡铟氧化物形成的尖锐尖头相比,这种材料显示出高的腐蚀速率,并且形成了丘陵和谷形的尖头和环形坑。

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