A Method for Rapid, Automated, Full-field Infrared Photoelastic Stress Analysis

摘要

A new infrared photoelastic stress analysis system has been developed utilizing the concept of grey-field photoelasticity. Therndevice is nearly completely automated and can capture images in less than 10 seconds, surmounting the limitations of currentrninfrared photoelasticity techniques. Initial results are presented using bonded MEMS devices that contain trappedrncontaminant particles and buried layer thickness variations. This technique can detect dust particles smaller than currentrninfrared imaging techniques because it measures stress induced birefringence instead of electromagnetic wave interferencerneffects.