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An Advanced Sparsity-based Photoacoustic Image Reconstruction Algorithm for Linear-Array Transducer Scenario

机译:线性阵列换能器场景下基于稀疏度的光声图像重建算法

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摘要

One of the most common algorithms used in linear-array photoacoustic imaging, is Delay-and-Sum (DAS) beam-former due to its simple implementation. The results show that this algorithm results in a low resolution andhigh sidelobes. In this paper, it is proposed to use the sparse-based algorithm in order to suppress the noise leveleu000eciently and improve the image quality. The forward problem of the beamforming is dened through a Leastsquare (LS) method, and a ℓ_1-norm regularization term is added to the problem which forces the sparsity of theoutput to the existing minimization problem. The new robust method, named sparse beamforming (SB) method,significantly suppresses the sidelobes and reduces the noise level due to the sparse added term. Numerical resultsshow that SB leads to signal-to-noise-ratio improvement about 98.69 dB and 82.26 dB, in average, compared toDAS and Delay-Multiply-and-Sum (DMAS), respectively. Also, the full-width-half-maximum is improved about396 μm and 123 μm, in average, compared to DAS and DMAS algorithms, respectively, using the proposed SBmethod, which indicates the good performance of SB method in image enhancement.
机译:线性阵列光声成像中最常用的算法之一是延迟和总和(DAS)波束形成器,这是因为其实现简单。结果表明,该算法导致了较低的分辨率和较高的旁瓣。本文提出了基于稀疏的算法,以有效抑制噪声水平,提高图像质量。通过最小二乘(LS)方法定义波束成形的正向问题,并将ℓ_1范数正则化项添加到该问题中,这迫使输出的稀疏性成为现有最小化问题。新的鲁棒方法被称为稀疏波束成形(SB)方法,由于添加了稀疏项,因此可以显着抑制旁瓣并降低噪声水平。数值结果表明,相比于rDADS和延迟乘和总和(DMAS),SB分别平均使信噪比提高了约98.69 dB和82.26 dB。此外,与提出的SB \ r \ n方法相比,分别与DAS和DMAS算法相比,全宽半最大值分别提高了约\ r \ n396μm和123μm,这表明SB具有良好的性能图像增强方法。

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  • 来源
    《Photons Plus Ultrasound: Imaging and Sensing 2019》|2019年|108786O.1-108786O.7|共7页
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    Department of Biomedical Engineering, Tarbiat Modares University, Tehran, Iran;

    Department of Biomedical Engineering, Tarbiat Modares University, Tehran, Iran;

    Department of Biomedical Engineering, Wayne State University, Detroit, MI, United States;

    Department of Biomedical Engineering, Wayne State University, Detroit, MI, United States;

    Department of Biomedical Engineering, Tarbiat Modares University, Tehran, Iran morooji@modares.ac.ir;

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