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Extraction of depth information for 3D imaging using pixel aperture technique

机译:使用像素孔径技术提取3D成像的深度信息

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摘要

A 3dimensional (3D) imaging is an important area which can be applied to face detection, gesture recognition, and 3D reconstruction. In this paper, extraction of depth information for 3D imaging using pixel aperture technique is presented. An active pixel sensor (APS) with in-pixel aperture has been developed for this purpose. In the conventional camera systems using a complementary metal-oxide-semiconductor (CMOS) image sensor, an aperture is located behind the camera lens. However, in our proposed camera system, the aperture implemented by metal layer of CMOS process is located on the White (W) pixel which means a pixel without any color filter on top of the pixel. 4 types of pixels including Red (R), Green (G), Blue (B), and White (W) pixels were used for pixel aperture technique. The RGB pixels produce a defocused image with blur, while W pixels produce a focused image. The focused image is used as a reference image to extract the depth information for 3D imaging. This image can be compared with the defocused image from RGB pixels. Therefore, depth information can be extracted by comparing defocused image with focused image using the depth from defocus (DFD) method. Size of the pixel for 4-tr APS is 2.8 um x 2.8 um and the pixel structure was designed and simulated based on 0.11 μm CMOS image sensor (CIS) process. Optical performances of the pixel aperture technique were evaluated using optical simulation with finite-difference time-domain (FDTD) method and electrical performances were evaluated using TCAD.
机译:3维(3D)成像是一个重要的领域,可以应用于面部检测,手势识别和3D重建。在本文中,提出了使用像素孔径技术提取3D成像的深度信息。为此,已经开发了具有像素内孔径的有源像素传感器(APS)。在使用互补金属氧化物半导体(CMOS)图像传感器的常规照相机系统中,光圈位于照相机镜头的后面。但是,在我们提出的相机系统中,由CMOS工艺的金属层实现的光圈位于白色(W)像素上,这意味着该像素顶部没有任何滤色器。像素孔径技术使用了包括红色(R),绿色(G),蓝色(B)和白色(W)像素在内的4种类型的像素。 RGB像素产生模糊的散焦图像,而W像素产生聚焦的图像。聚焦图像用作参考图像以提取用于3D成像的深度信息。可以将该图像与RGB像素的散焦图像进行比较。因此,可以通过使用离焦深度(DFD)方法将散焦图像与聚焦图像进行比较来提取深度信息。 4-tr APS的像素大小为2.8 um x 2.8 um,并且基于0.11μmCMOS图像传感器(CIS)工艺设计和模拟了像素结构。使用具有有限差分时域(FDTD)方法的光学仿真来评估像素孔径技术的光学性能,并使用TCAD来评估电性能。

著录项

  • 来源
    《Photonic Instrumentation Engineering IV》|2017年|101101S.1-101101S.6|共6页
  • 会议地点 San Francisco(US)
  • 作者单位

    School of Electronics Engineering, Kyungpook National University 80 Daehak-ro, Buk-gu, Daegu, 41566, Korea;

    School of Electronics Engineering, Kyungpook National University 80 Daehak-ro, Buk-gu, Daegu, 41566, Korea;

    School of Electronics Engineering, Kyungpook National University 80 Daehak-ro, Buk-gu, Daegu, 41566, Korea;

    School of Electronics Engineering, Kyungpook National University 80 Daehak-ro, Buk-gu, Daegu, 41566, Korea;

    School of Electronics Engineering, Kyungpook National University 80 Daehak-ro, Buk-gu, Daegu, 41566, Korea;

    Center for Integrated Smart Sensors (CISS), KAIST 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Korea;

    Center for Integrated Smart Sensors (CISS), KAIST 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Korea;

    Center for Integrated Smart Sensors (CISS), KAIST 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Korea;

    School of Electronics Engineering, Kyungpook National University 80 Daehak-ro, Buk-gu, Daegu, 41566, Korea;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    CMOS; image sensor; pixel; aperture; color filter; 3D imaging; depth from defocus; active pixel sensor;

    机译:CMOS;图像传感器;像素光圈;彩色滤光片3D成像;离焦深度有源像素传感器;

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