New Hybrid Large DIPIPMTM for PV Application with built-in SiC-SBD and seventh-generation CSTBTTM

摘要

A new transfer mold type hybrid Silicon Carbide (SiC) large DIPIPMTM developed for photovoltaic (PV) power generating application is presented in this paper.The new DIPIPMTM is designed with built-in SiC Schottky Barrier Diode (SBD) and seventh-generation CSTBTTM chip that helped to achieve about 25％ power loss reduction compare with Mitsubishi Electric's existing PV DIPIPMTM.