IMPACT OF CHANNEL GEOMETRY ON HEAT TRANSFER IN MICROCHANNEL FOR HIGH DENSITY ELECTRONICS COOLING

摘要

Numerical heat transfer solutions from various shapes of microchannel heat sinks are presented in this paper. While extensive work exists for the rectangular microchannel cross sectional area, other cross sections have not received the same attention. A comparison between the heat transfer cross sectional areas of the various geometries used in engineering applications is made in this study. Utilizing the numerical aolutions, the contributions of cross sectional shape, aspect ratio and channel configurations are presented. The aspect ratio and the effective resistivity of the fluid/substrate system are identified as key parameters of the effective heat transfer microstructure. The results are presented in nondimensionalized form applicable to any fluid and geometric aspect ratio combination presented herein.