ESTIMATION OF CURRENT SHIPPING ENVIRONMENTS FOR PROCESSOR PRODUCTS AND SYSTEMS TO DESIGN ACCELERATED TEST SUITES

摘要

Electronic products are shipped in ways potentially exposing them to a wide range of temperatures, humidity and vibration. In order to ensure optimum robustness in the product it is crucial to have a validation test suite based on a realistic shipping environment. This paper attempts to comprehend the temperature, humidity and shock/vibration environment endured by processor products and systems, during shipping and handling. The study is conducted by shipping servers and desktop platforms, and multi-chip modules (MCMs), via a wide cross section of probable shipping conditions. The measured data is analyzed to verify typical shock and vibration test standards. The severity of temperature and humidity environments during shipping/handling is also determined qualitatively.