首页> 外文会议>Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97 >An Engineering Model To Simulate the Thermal Response of Electronic Devices During Pulsed Nd: YAG Laser Welding
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An Engineering Model To Simulate the Thermal Response of Electronic Devices During Pulsed Nd: YAG Laser Welding

机译:模拟电子设备在脉冲Nd:YAG激光焊接过程中热响应的工程模型

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摘要

A model is developed to predict the thermal response of 'real' electronic devices during pulsed Nd: YGA laser weld-ing. Modeling laser-apart interaction requiress ncorporation f weld pool hydrodynamics. and laser-metal vapor and laser-surface interaction. Although important information can be obtained from these models, they are not appropriate for use in design of actural components due to computational linitations. In lieu of solving for these detailed physics, a simple model is constructed. In this model, laser-part interactions are accounted for through an empirically determined energy transfer efficiency which is developed through the use of modelin and experients. This engineering model is appropriate since the thermal response of termperature sensitive components away fromthe weld pool is the primary interest here. Reasonable agreement between predictions and experiemntal measurements for welding of real components are indicated.
机译:开发了一个模型来预测Nd:YGA脉冲激光焊接过程中“真实”电子设备的热响应。建模激光分开相互作用需要结合熔池流体动力学。以及激光金属蒸气和激光表面相互作用。尽管可以从这些模型中获取重要信息,但由于计算上的限制,它们不适合用于设计活动部件。代替解决这些详细的物理学,构建了一个简单的模型。在此模型中,激光零件的相互作用是通过经验确定的能量传递效率来解决的,该效率是通过使用modelin和经验方法开发的。这种工程模型是合适的,因为这里的温度敏感部件远离焊接熔池的热响应是主要关注点。指出了预测和实物焊接的实验测量之间的合理一致性。

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