Alternative materials and processes for hf-modules

摘要

High Frequency integrated Circuits (HFICs) can have HF l/O count of 1-100 depending on the functionality from oscillators to large crosspoint switches, but no standard packaging approach is available that covers all categories of such circuits up to frequencies in excess of 60GHz. The situation is especially difficult for wideband applications [1]. This paper studies standard microwave-packaging approaches from a wide perspective and presents an alternative fully planar package substrate fabrication technique. This technique utilises standard IC-technologies with ordinary cleanroom equipment. The presented method results from HF package substrate development work performed at Cornell Nanofabrication Facility (CNF). This novel technique passes package design control over to academic circuit designers in an affordadle and flexible manne without sacrificing electrical requirements. The performance of a package unit, especially wideband high frequency, given current standard approaches is defined by packaging characteristics rather than the chip(s). The aim of this approach is to initiate evolvement of procedures that allow the chip performance to be the limiting factor.