This paper describes a 'smart pixel array module' (SPAM) technology for free space optical interconnects that is being developed to address future electrical interconnect density bottlenecks anticipated in very high data throughput (beyond Terabit/s or Tbps) applications such as large telecom/datacom switches to multiprocessor signal and image processing applications. Honeywell is collaborating with two consortium teams to develop the SPAM technology, and provide both team with SPAMs that enable system demonstrations that optically connect such 2D arrays of SPAMs in the third dimension in free space. One such consortium program is called '3D optoelectronic stacked processor (3D OESP)' led by UCSD [1]. The second program is called 'Free-space Accelerator for Switching Terabit Networks' (FAST-Net), led by BDM [2].
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