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Recent Progress in the Vacuum Deposition of OLEDs with Feature Sizes ≤ 20um Using a Contact Shadow Mask Patterned In-situ by Laser Ablation

机译:使用激光烧蚀就地构图的接触阴影掩模在特征尺寸≤20um的OLED真空沉积中的最新进展

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We report progress in the development of a new technique that has the potential to enable the vacuum deposition of OLEDs with feature sizes ≤ 20um, and hence high resolution OLED displays. An OLED device with 16um by 130um sub-pixel size has been successfully demonstrated utilizing the novel idea of the in-situ shadow mask patterning method showing the capability to achieve high resolution OLED patterning. In the approach proposed here, two sheets of polyimide film are mounted on the bottom electrode of an OLED. The top sheet of the two stacked sheets is patterned in-situ by laser ablation to create apertures to function as a deposition shadow mask. The lower sheet, which serve as a protective layer to the electrode during the laser ablation step is then removed, and OLED materials are deposited through the now patterned top sheet. Since mask alignment is not required in this approach, the technique circumvents the resolution limitations imposed by the difficulty of aligning shadow masks in the conventional techniques, and allows achieving high resolution pixel patterning. Furthermore, shadow effects, another factor that limits resolution in conventional techniques, can be reduced due to the use of very thin polyimide film (~7.5um) that is directly held on the substrate by electrostatic force. In principle, by applying this technique to the standard three color side-by-side sub-pixel matrix scheme, a resolution and aperture ratio of 338ppi and 60%, respectively, can be expected, which is estimated based on the fact that the width of the deposited material is 25um for the 16um wide electrode.
机译:我们报告了一项新技术的开发进展,该技术有可能实现真空沉积特征尺寸≤20um的OLED,从而实现高分辨率OLED显示器。利用原位荫罩图案化方法的新颖思想成功展示了具有16um x 130um子像素尺寸的OLED器件,该器件显示了实现高分辨率OLED图案化的能力。在这里提出的方法中,将两片聚酰亚胺膜安装在OLED的底部电极上。通过激光烧蚀在原处图案化两个堆叠的片材的顶片,以产生用作沉积阴影掩模的孔。然后去除在激光烧蚀步骤中用作电极保护层的下层,然后通过现已形成图案的上层沉积OLED材料。由于在该方法中不需要掩模对准,因此该技术规避了由常规技术中的对准荫罩的困难而引起的分辨率限制,并且允许实现高分辨率的像素图案化。此外,由于使用了非常薄的聚酰亚胺薄膜(约7.5um),该薄膜通过静电力直接保持在基板上,因此阴影效应是限制传统技术分辨率的另一个因素,可以减少这种效应。原则上,通过将该技术应用于标准的三色并排子像素矩阵方案,可以预期分辨率和孔径比分别为338ppi和60%,这是基于以下事实估算的:对于16um宽的电极,沉积材料的25%为25um。

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