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Alternative to ILT method for high quality full-chip SRAF insertion

机译:高质量全芯片SRAF插入的ILT方法的替代方法

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A novel approach to Sub-Resolution Assist Feature (SRAF) generation suitable for full-chip production scale applications is discussed in this work. The method enables generation of free-form SRAF insertion guidelines similar to those obtained by solving the inverse lithography problem. The guidelines encompass layout areas where total net effect of an elementary SRAF placement is positive taking into account all neighboring target features. The essence of the method is the assumption that the total impact of placing an elementary SRAF close to several neighboring features can be calculated as a sum of impacts to individual target features, or a simple mathematical function could be used to perform this calculation. Reduction of the SRAF insertion problem to the linear addition of "usefulness" metric on a grid enables the method to be exceptionally computationally efficient. Tests on an aggressive 28nm 100×100 urn design contact array clips have confirmed 3+ orders of magnitude faster free-form SRAF generation as compared to commercially available ILT engines.
机译:在这项工作中讨论了一种适用于全芯片生产规模应用的次分辨率辅助特征(SRAF)生成的新颖方法。该方法能够生成类似于通过解决反光刻问题而获得的自由形式SRAF插入准则。该指南涵盖了布局区域,其中考虑到所有相邻目标特征,基本SRAF布局的总净效果为正。该方法的本质是假设可以将基本SRAF放置在几个相邻特征附近的总影响可以计算为对各个目标特征的影响之和,或者可以使用简单的数学函数来执行此计算。通过将SRAF插入问题减少为在网格上线性添加“有用性”度量,可以使该方法具有非凡的计算效率。在具有攻击性的28nm 100×100 um设计接触阵列夹上进行的测试已经证实,与市售ILT引擎相比,自由形式SRAF的生成速度提高了3个数量级。

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