InkJet Assisted Micro-scale cooling of Electronics Enabling device compaction by efficient thermal management

摘要

Micro-scale cooling can enable compaction of microelectronic and MEMS devices. The use of thermal inkjet technology to precisely supply coolant onto the surface of a microprocessor has the potential to address this problem in a micro-scale form factor. By providing coolant when and where it is needed on the surface of a chip or package, very high critical heat fluxes can be obtained in an energy efficient manner in a minimum of physical space. Results from an experimental test bed provide valuable data to benchmark and develop understanding of inkjet assisted spray cooling. Analysis of these results also provides a window into future paths of research for efficient ink jet assisted spray cooling with jet impingement control.