Foreword

摘要

This compilation of Selected Technical Papers, STP1574, Next Generation Thermal Insulation Challenges and Opportunities, contains peer-reviewed papers that were presented at a symposium held October 23-24, 2013 in Jacksonville, FL. The symposium was sponsored by ASTM International Committee C16 on Thermal Insulation. The Symposium Co-Chairpersons and STP Co-Editors are Therese K. Stovall, Oak Ridge National Laboratory, Retired, Oak Ridge, TN, USA and Thomas Whitaker, Industrial Insulation Group, Retired, Grand Junction, CO, USA.