Design of an implantable intracortical microelectrode system for brain-machine interfaces

摘要

The long-term goal in the design of Brain-Machine Interfaces is to restore communication and control to unrestrained individuals. One of the great challenges in this effort is to develop implantable systems that are capable of processing the activity of large ensembles of cortical neurons. Here, we present the design, fabrication, and testing of a flexible microelectrode array that can be hybrid-packaged with custom electronics in a fully implantable form factor. The design specifications and process flow for incorporating flip-chip bonding of an amplifier die are discussed.