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Improved Characterization of high-k Degradation with Vacuum C-AFM

机译:真空C-AFM改进了高k降解的表征

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Local phenomena like trap assisted tunneling and oxide breakdown (BD) in new high-k gate oxides in advanced MOS devices hinder the acquisition of device requirements stated in the International Technology Roadmap for Semiconductors (ITRS). Conductive Atomic Force Microscopy (C-AFM) visualizes these local phenomena by measuring the local tunneling through the dielectric. In the first part of this work we show that the physical composition of surface protrusions, that are produced at sites electrically stressed with C-AFM and that distort the electrical measurements, is oxidized Si. In the second part, we illustrate that C-AFM measurements become more reliable in high vacuum (1e~(-5) torr) as surface damage (oxidized Si protrusions) and tip damage are reduced. Finally, we illustrate good agreement between conventional macroscopic electrical measurements and nanometer-scale C-AFM measurements on normal and gate - removed high-k capacitors, respectively. Moreover, to illustrate the strength of the local tunneling technique, we show the possibility of locating BD spots on a high-k capacitor.
机译:先进的MOS器件中新的高k栅极氧化物中的陷阱辅助隧穿和氧化物击穿(BD)等局部现象妨碍了《国际半导体技术路线图》(ITRS)中所述器件的要求。导电原子力显微镜(C-AFM)通过测量穿过电介质的局部隧穿来可视化这些局部现象。在这项工作的第一部分中,我们证明了在C-AFM电应力作用下产生的表面突起的物理成分被氧化了的Si,这些表面畸变了电学测量值。在第二部分中,我们说明随着表面损伤(氧化硅突起)和尖端损伤的减少,C-AFM测量在高真空(1e〜(-5)托)下变得更加可靠。最后,我们说明了常规的宏观电学测量和分别在普通和栅极去除的高k电容器上的纳米级C-AFM测量之间的良好一致性。此外,为了说明局部隧穿技术的优势,我们展示了在高k电容器上定位BD点的可能性。

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