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3D MMIC compact semi-lumped loaded CPW stubs for spurious suppression fabricated with a standard air bridge process

机译:3D MMIC紧凑型半集总负载CPW存根,用于通过标准气桥工艺制造的杂散抑制

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Compact and harmonic suppression semi-lumped stubs based on a CPW/thin film microstrip combination using 3D on-chip air-core solenoid and elevated symmetric inductors are proposed. The stubs are implemented using an MMIC airbridge process to realize an elevated transmission line and 3D inductors. These 3D inductors are used to load open circuit CPW/TFMS stubs in order to reduce their sizes. In addition to size reduction, an excellent suppression of spurious harmonic responses are achieved with improved dielectric loss which are inherent in these types of semi-lumped stubs. The experimental results presented in this paper demonstrate the validity of the design method.
机译:提出了一种基于CPW /薄膜微带组合的紧凑型和谐波抑制半集总管,该组合使用3D片上空心螺线管和高架对称电感器。存根是使用MMIC空桥过程实现的,以实现高架传输线和3D电感器。这些3D电感器用于加载开路CPW / TFMS存根,以减小其尺寸。除了减小尺寸之外,还通过改善介电损耗实现了对寄生谐波响应的出色抑制,这是这些类型的半集总短管中固有的。本文给出的实验结果证明了该设计方法的有效性。

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