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Development of High Thermal Conductivity Epoxy Composite for Large Current Switchgear

机译:大电流开关柜高热导率环氧复合材料的研制

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Since SF6 gas used as an insulating medium for switchgear is a greenhouse gas, its use needs to be reduced. Toshiba Corporation has developed solid insulated switchgear (SIS) in which the main circuit is molded with an epoxy composite. Since developing the 24 kV class SIS in 2002, a 72/84 kV class SIS has been launched. The high dielectric strength of the epoxy composites enables these solid insulation systems to provide compact equipment. However, it is necessary to consider the problem of heat radiation in SIS, as epoxy composite has low thermal conductivity. Therefore, development of high thermal conductivity epoxy composites has been desired for large current class SIS. In this study, we focus on magnesium oxide (MgO), which has a thermal conductivity having low-cost. The developed epoxy composite was filled with MgO having high thermal conductivity and SiO2 having a low coefficient of thermal expansion. By using the estimation equations of thermal conductivity and coefficient of thermal expansion, we could efficiently determine the formulation of the high thermal conductivity epoxy composite. The thermal conductivity of the developed material was 1.39 W/(m·K), which is equivalent to 2.5 times that of conventional material. In addition, other characteristics also showed excellent values, such as 23×10-6/K of the coefficient of thermal expansion and 2,513 mPa.s of viscosity. These values satisfied the required ones for large current SIS. Thermal analysis revealed that applying the high thermal conductivity epoxy composite to 2500 A SIS can reduce the temperature rise by about 10 K. By applying the high thermal conductivity epoxy composite, we are convinced that a large current of SIS with merits such as low maintenance and compactness will be realized.
机译:自从SF. 6 用于开关设备的绝缘介质的气体是温室气体,需要减少其使用。东芝公司开发了坚固的绝缘开关设备(SIS),其中主电路用环氧复合材料模制。自2002年开发24辆KV级SIS以来,已启动72/84 kV级SIS。环氧复合材料的高介电强度使这些固体绝缘系统能够提供紧凑的设备。然而,有必要考虑SIS中热辐射的问题,因为环氧复合材料具有低导热性。因此,对于大型电流级SIS而言,已经期望高导热率环氧复合材料的发展。在这项研究中,我们专注于氧化镁(MgO),其具有低成本的导热率。开发的环氧复合材料填充有具有高导热率和SIO的MgO 2 具有低的热膨胀系数。通过使用导热率和热膨胀系数的估计方程,我们可以有效地确定高导热环氧基复合材料的配方。发育材料的导热率为1.39W /(m·k),相当于常规材料的2.5倍。此外,其他特征还显示出优异的值,例如热膨胀系数的23×10-6 / k和2,513MPa。粘度。这些值满足了大型当前SIS所需的值。热分析显示,将高导热率环氧复合材料施加到2500A SIS可以将温度升高约10k。通过施加高导热率环氧复合材料,我们确信具有低维护等优点的SIS的大电流和将实现紧凑性。

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