首页> 外文会议>IET Colloquium on Millimetre-Wave and Terahertz Engineering Technology >EVALUATION OF GAIN ENHANCEMENT IN LARGE MICROSTRIP ANTENNA ARRAYS FOR MM-WAVE APPLICATIONS
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EVALUATION OF GAIN ENHANCEMENT IN LARGE MICROSTRIP ANTENNA ARRAYS FOR MM-WAVE APPLICATIONS

机译:MM波应用中大微带天线阵列中增益增强的评价

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Microstrip patch antenna arrays (MPAAs) have been designed with different numbers of patch elements and substrate heights to evaluate the antenna gain enhancement for millimetre-wave (mm-wave) (30-300GHz) applications. The patch antenna size extension method is employed to improve the tolerance in fabrication with low cost printed circuit board (PCB) etching process. Initially, the designing concept is analysed at 10GHz frequency and then the optimized high gain (~21dBi) array is fabricated and tested at 60GHz-band (57.24-65.88GHz). It has been found that the loss contribution due to the long feeding transmission line (TL) network in large MPAAs severely degrades the antenna gain when thick substrate is deployed. However, by employing relatively thinner substrate gain can be significantly enhanced in large arrays but cost has to be paid in terms of narrower return loss (S11) bandwidth (BW) and higher side lobe level (SLL). Finally, the optimized MPAA has been redesigned at 100GHz frequency on a thin PCB substrate and a good relation has been achieved between the antenna results obtained at 100GHz and 60GHz frequencies.
机译:微带贴片天线阵列(MPAAS)设计有不同数量的贴片元件和基板高度,以评估毫米波(MM波)(30-300GHz)应用的天线增益增强。用低成本印刷电路板(PCB)蚀刻工艺采用贴片天线尺寸扩展方法来改善制造的公差。最初,在10GHz频率下分析设计概念,然后在60GHz波段(57.24-65.88GHz)中制造和测试优化的高增益(〜21dBi)阵列。已经发现,当展开厚基板时,由于大的MPAAS中长的馈送传输线(TL)网络引起的损失贡献严重降低了天线增益。然而,通过采用相对较薄的衬底增益,可以在大阵列中显着增强,但必须在较窄的回波损耗(S11)带宽(BW)和更高的侧凸电平(SLL)方面支付成本。最后,优化的MPAA已经在薄的PCB基板上以100GHz频率重新设计,并且在100GHz和60GHz频率获得的天线结果之间已经实现了良好的关系。

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