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Lithography Rework Reduction and Improved Process Control using AIM Targets on Aluminum Layers in the High Volume Production of 110nm DRAM Devices

机译:光刻效率减少和改进的过程控制使用铝层对110nm DRAM器件的大量生产中的铝层上的目标

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AIM grating targets were optimized and implemented on the metal 2 Aluminum layer in high volume production of 110nm DRAM devices. Grating target structures are intrinsically more compatible with Aluminum process design rules, allowing overlay target optimization to better fit the process and better cope with the large grain structure of the Aluminum layer. With the implementation of AIM overlay targets we were able to achieve tighter control of the Aluminum patterning, we also achieved smaller overlay residuals, better matching between post litho and post etch measurements, better modeling and less rework. Above all, AIM targets improve the overlay metrology tool capability and provide a better tool-to-tool matching performance.
机译:在高批量生产的金属2铝层上优化并在110nm DRAM器件中进行优化和实施目标光栅靶标。光栅靶结构与铝工艺设计规则有本质上更兼容,允许覆盖目标优化以更好地拟合该过程和更好地应对铝层的大颗粒结构。随着AIM覆盖目标的实施,我们能够实现更紧密地控制铝制图案,我们还实现了较小的覆盖性残差,在帖子柱和蚀刻后测量之间更好地匹配,更好的建模和更少的返工。最重要的是,AIM目标可以提高覆盖度量工具功能,并提供更好的工具到工具匹配性能。

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