MEMS (Micro ElectroMechanical Systems) have been developed based on a silicon bulk micromachining. Wafer process packaging was applied to electrostatically levitated rotational gyroscope and micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and SNOM were developed. Hydrogen storage capacity of carbon nanotube was measured using resonant frequency shift of thin silicon cantilever.
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