How to influence bondability of different metallization systems using methods of mechanical pretreatment

摘要

The quality of Chip on Board (COB) components and products is influenced by various process steps. Beginning with surface metallization and ending with glob topping every step has importance for bondability and reliability. Experience shows, that good wire bond quality can only be achieved with well defined (PCB) surface metallization properties. These properties are of course defined by the metallization system itself and its composition, but also by properties like roughness, hardness and system homogeneity. Our experiments will show, how wire bond quality can be "influenced by different methods of mechanical pretreatment under different metallization conditions. These results will help to specify PCB quality for COB applications.