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Measurement System Analysis for Semiconductor Measurement Process

机译:半导体测量过程的测量系统分析

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Quality management is an essential factor for enhancing the competitiveness of a company, and it is important to determine the capability of the measurement system in process improvement activities for quality improvement. In general, some observed dispersions in measurement-related activities are inherent in the product being measured, while others are due to the measurement system used. Semiconductor products are processed through a complex process, and quality control is performed through various measurement processes during the production process. Among them, wafer testing, which is the last step in manufacturing, is an important process to judge the quality of semiconductor products. In the wafer test process, an automatic test equipment (ATE) is used to check the electrical features of the created chips on the wafer, and to judge whether good or not products. To test wafers in ATE, it is necessary to connect to the chip electrode, PAD. Probe Card is used at this time. As a replaceable part, it is made and used according to the product and is generally in a parallel structure to test more quickly and efficiently many chips on a wafer. Since the probe card is extremely sensitive and detailed component, deformation such as abrasion occurs as it is used and affects the wafer test result. This paper presents an algorithm that can analyze the measurement system using the test result data of the measured wafer in order to maintain the optimum state of the ATE and Probe Card, the measurement system of the wafer test process. And using this algorithm, we propose the automated measurement process quality management system (AMPQMS) for the wafer test process. The real-time measurement system analysis algorithms are utilized several statistical analysis methods that analyzes the repeatability and reproducibility of the instrument. AMPQMS can properly combine various analysis algorithms for each product. The quality of the measurement system is real time managed using the analyzed results by the analysis algorithms.
机译:质量管理是提高公司竞争力的重要因素,重要的是确定测量系统在过程改进活动中的能力改善的能力。通常,测量相关活动中的一些观察分散在测量的产品中是固有的,而另一些则是由于使用的测量系统。半导体产品通过复杂的过程处理,通过生产过程中的各种测量过程进行质量控制。其中,晶圆测试是制造的最后一步,是判断半导体产品质量的重要过程。在晶片测试过程中,自动测试设备(ATE)用于检查晶片上产生的芯片的电气特征,并判断是否有产品。为了在ATE中测试晶片,有必要连接到芯片电极,垫。此时使用探针卡。作为可更换的部分,根据产品制造和使用,并且通常在平行结构中,以更快速,有效地测试晶片上的许多芯片。由于探针卡是极其敏感和细节的组成部分,因此在使用并影响晶片测试结果时,发生诸如磨损的变形并影响。本文介绍了一种算法,可以使用测量的晶片的测试结果数据来分析测量系统,以便保持ATE和探针卡的最佳状态,晶片测试过程的测量系统。并使用该算法,我们提出了用于晶圆测试过程的自动测量过程质量管理系统(AMPQMS)。实时测量系统分析算法利用了几种统计分析方法,分析了仪器的可重复性和再现性。 AMPQMS可以正确地将各种分析算法组合,适用于每个产品。测量系统的质量是使用分析算法使用分析结果管理的实时。

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