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Surface Wave Reduction in Integrated Microstrip Patch Antenna at 60GHz Band

机译:60GHz频段的集成微带贴片天线的表面波减少

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In this paper present a comparing between different techniques that used to enhance the performance of integrated micro-strip patch antennas at 60GHz band. These include tapered feed matching, back holes and Electromagnetic Band Gab (EBG) to reduce the surface waves losses. The antenna structures which are proposed in this paper combines the advantages of inset taper micro-strip feed line with the advantages of backed holes patch antenna and electromagnetic band gap (EBG) which is simplifies the antenna structure to make it easier to integrate the micro-strip patch antenna with MMICs. A significantly increased radiation efficiency has been shown by the back holes patch antennas compared to micro-strip patch antennas directly printed on top of the same Gillum Arsenate (GaAs) substrate. The simulation results show that the maximum predicted gain is 3.9dB for the antennas of the cylindrical back holes, while a conventional micro-strip patch on the same substrate has a maximum predicted gain of 1.9dB. The antenna of the EBG structures shows broadband characteristics. The 10dB bandwidth is 7.3 GHz from 57.8 GHz to 64.5 GHz. The simulation process has been done through 3D high frequency structure simulator (HFSS).
机译:在本文中,目前用于增强60GHz频段的集成微带贴片天线性能的不同技术的比较。这些包括锥形进料匹配,后孔和电磁带GAB(EBG),以减小表面波损耗。本文提出的天线结构结合了插孔锥形微带进料管的优点与背孔贴片天线和电磁带隙(EBG)的优点,这简化了天线结构,使其更容易集成微型 - 带MMIC的剥离贴片天线。与直接印刷在同一甘蓝砷(GaAs)衬底的顶部的微带贴片天线相比,后孔贴片天线示出了显着提高的辐射效率。仿真结果表明,对于圆柱形背孔的天线,最大预测增益为3.9dB,而同一基板上的传统微带贴片的最大预测增益为1.9dB。 EBG结构的天线显示宽带特性。 10dB带宽为7.3 GHz,从57.8 GHz到64.5 GHz。通过3D高频结构模拟器(HFSS)完成了仿真过程。

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