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Relationship between Current Density, Crystal Grain Size, Composition and Hardness in Electrodeposited Ni-Co Alloys

机译:电沉积Ni-Co合金电流密度,晶粒尺寸,组成和硬度之间的关系

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Nickel, cobalt, and their alloys are important engineering materials in many applications because of theirunique properties, such as magnetic, heat-conductive and high hardness. Their alloy films have attractedmuch attention and are widely used in micro-electrical-mechanical systems (MEMS) devices due toexcellent electrical and mechanical properties. Pure Ni films are known for high hardness property, and themechanical strength can be further improved by solid solution strengthening. Electroplating (EP) is oftenused in preparation of Ni-Co alloy films because the morphology, crystal structure, and deposition rate ofthe deposited materials can be facilely controlled by varying the EP parameters [1], such as the currentdensity, bath composition, and temperature [2]. Reliability of electronic components is highly dependent onthe mechanical property, which is closely related to its average grain size according to the Hall-Petchrelationship [3]. Therefore, in this study, the effects of applied current density on average grain size,Vickers hardness, and micro-mechanical properties of electrodepositedNi-Co films are evaluated for fabrication of micro-components inelectronic devices.
机译:镍,钴和它们的合金是许多应用中的重要工程材料,因为它们独特的性质,如磁,导热和高硬度。他们的合金薄膜吸引了很多关注并广泛用于微电机机械系统(MEMS)设备优异的电气和机械性能。纯Ni薄膜已知高硬度特性,以及通过固溶强化可以进一步提高机械强度。电镀(EP)通常是用于制备Ni-Co合金薄膜,因为形态学,晶体结构和沉积速率沉积的材料可以通过改变EP参数[1],例如当前来保护沉积的材料密度,浴组合物和温度[2]。电子元件的可靠性高度依赖根据霍尔竖起,与其平均晶粒尺寸密切相关的机械性能关系[3]。因此,在本研究中,施加电流密度对平均晶粒尺寸的影响,维氏硬度,电沉积的微机械性能评估NI-CO膜以制备微量组分电子设备。

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