Analysis of Forces during UV Glue Curing for Micro-Assembly Applications

摘要

Positional drift resulted from the glue curing may result into serious challenges towards accuracy especially for micro-assembly processes. Studying forces and positional drifts resulted from the glue curing appears as a key objective towards reaching precise micro-assemblies. For this reason, works notably investigate the forces and displacements originated from the UV glue curing. Experimental investigations demonstrates that the force induced during the glue curing is in 160 μN range against a micro-object with cross section of 500 x 500 μm, and the corresponding positional drift in the 10 μm range was obtained. Works also show that these values depend on the system and strategy used for the assembly.