Investigating the designed parameters of Dual-Layer Micro-Channel Heat Sink by design for Six Sigma (DFSS)

摘要

An application of robust design follows the logic of the DMADV as an approach for quality problem solving is proposed to design, and develop a better heat transfer device with smaller dimensions, higher thermal diffusion, and smaller power supply. To predict fluid flow, heat transfer, pressures drop, values of parameters as well as predicting related phenomena, the study of a silicon Microchannel heat sink model was obtained by the Computational Fluid Dynamics software (Fluent) and the Taguchi method. The optimize parameters of the micro-channel heat sink, and the adequately handled numerical functions were analyzed by Minitab 17. The results show that a good agreement was achieved for the comparison of the minimum pressure drop and thermal resistance of the microchannel with other researchers.