A novel 3-D printed electrmagnetic bandgap structure for parallel plate mode suppression in microstrip circuit packages

摘要

In this paper, a novel 3-D printed electromagnetic bandgap structure is proposed for parallel plate mode suppression in microstrip circuit packages. The dispersion analysis of the proposed EBG shows that its stopband bandwidth is enhanced compared with the previous work and it electric size is reduced to 0.21λ×0.21λ×0.18λ. 3-D printing technique is used to print the prototype and a simple microstrip line is fabricated for testing its performance. The measured results show that the parallel plate modes in the stopband of the proposed EBG structure are suppressed and the insertion loss of the microstrip line is similar to that of the unpackaged one.