Three-dimensional circuit boards for new products - LDS technology for medical devices – (PPT)

摘要

3D MIDs offer new potential for designers to reduce size and components by combining mechanical and electrical functionalities into a single device. The LPKF-LDS process has become established as the preferred technology for the production of molded interconnect devices due to the flexibility of laser structuring and its very short process chain. The variety of successfully implemented medical applications raises the expectations that the MID market for medical devices continue to grow over the next years.