An Efficient Technique for Accurate Modeling and Simulation of Substrate Coupling in Deep Micron Mixed-Signal IC's

摘要

Substrate noise in integrated circuits is a major impediment to mixed-signal integration. Accurate simulation is therefore, needed to investigate the generation, propagation, and impact of substrate noise. In this paper, we introduce novel substrate noise estimation and describe a fast and accurate simulator for modeling substrate coupling noise in mixed-signal RF IC design. Using a three-dimensional finite element method for extraction of substrate parasitic elements is developed.